Some boards may require a re-return to the furnace because of the maintenance relationship. The general resistance and capacitance are usually required to be reflowed at least three times, in order to meet the requirements. Again, the parts on the first panel must pass through the reflow oven twice, so the temperature resistance must be able to withstand the temperature of two reflows. For more information on designing PCBs, please visit ANDWIN CIRCUITS CO.,LTD. Because the first surface part will be placed directly on the bottom surface of the circuit board when facing the second side, when the board enters the high temperature of the reflow area, it will not fall off the board because of excessive weight. Second, the smaller parts do not risk falling when the second reflow oven is over. So, what should you think about when manufacturing double-sided reflow? Which SMD parts should be placed on the first side of the reflow oven?įirst of all, the smaller parts are recommended to be placed on the first side of the reflow oven, because the deformation of the PCB will be smaller when the first side passes through the reflow oven, and the precision of the solder paste printing will be higher, so it is better placed Smaller parts. For example, when the board goes to the second reflow furnace, the parts on the first side will fall due to gravity, especially The board flows to the furnace where the reflow zone is hot. Because of the limitations of the process, some problems may occur. Single-sided reflow is used less because double-sided reflow saves board space.ĭouble-sided reflow requires two reflows. Introduction to PCB double-sided reflow process (SMT)Ĭircuit board assembly technology, now popular in the industry is full-board reflow soldering (Reflow), this technology can be divided into single-panel reflow and double-panel reflow.
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